ELECTRICAL & ELECTRONICS INDUSTRY SOLUTION

Handle raw material distribution & scrap recycling, PCB board box handling & loading and unloading, semiconductor wafer box loading and unloading.

Business Challenges

Pedestrian-vehicle mix

Risky: Shared pathways; robots need high safety.

High precision demanded

High-value goods require precise multi-process integration.

Narrow passage

Early-built factory challenging to upgrade environment.

Challenging deployment environment

The laser-guided unsuitable: frequent movement, changes.

Key Aspects and Core Capabilities Exploring Innovation

1. Using AGV + racks enables timely recycling of raw materials and packaging waste on the production line.

2. Employing SMT robots allows for automatic handling and loading/unloading of PCB trays.

3. Utilizing mobile compound robots facilitates automatic loading and unloading of semiconductor wafer boxes.

4. Implementing unmanned forklifts enables the handling of entire pallets for inbound and outbound logistics.

Advantages of the Plan

LX-MRDVS® enables loading and unloading robots to navigate naturally without markers, ensuring stable localization despite ground environment interference using integrated positioning.

RCS connects with production management, enabling scheduling, task transitions, equipment connectivity, and real-time robot status visibility within the enterprise’s system.

LX-MRDVS® tech enables stable positioning amidst glass wall interference, with integrated cameras enhancing safety by detecting obstacles and operators.